Wuhan Xinli Research has developed nanoscale chip bonding equipment, achieving domestic substitution

Recently, Wuhan Xinli Technology Co., Ltd. has made a major breakthrough by successfully developing chip "bonding" equipment with nanometer level accuracy. The core components are independently developed by the enterprise, which not only breaks the monopoly of foreign technology, but also achieves domestic substitution in this field. The equipment has completed research and development and is about to enter the stage of chip production verification, injecting strong impetus into the high-quality development of China's chip industry.

Chip bonding is the core process of the packaging and testing stage after chip manufacturing, which is like building a bridge for chips. It requires precise calibration and bonding of multiple wafers or chips at the nanoscale precision to achieve atomic level integration, directly affecting the performance, volume, and reliability of chips. It is the core support of advanced packaging technology and widely used in fields such as AI chips, high-performance computing, and vehicle control chips. For a long time, the global market for high-end chip bonding equipment has been dominated by European, American, and Japanese companies. Domestic chip manufacturing companies can only rely on imports, which not only result in high procurement costs, but also face risks such as technology blockades and supply restrictions, seriously restricting the independent and controllable development of China's chip industry.

The biggest breakthrough of the chip bonding equipment developed by Wuhan Xinli Science and Technology Co., Ltd. this time is the realization of nanometer level precision control, which has overcome the core technology barriers that have long been monopolized by foreign countries. This device precisely controls the alignment accuracy and force control of key bonding, with core indicators reaching industry-leading levels. It can perfectly adapt to the high-precision requirements of advanced packaging fields. Compared with imported equipment, it not only achieves benchmarking in accuracy, but also optimizes equipment performance in combination with domestic chip production needs, making it more adaptable and cost-effective. Of particular note is that the core components of the equipment are independently developed and produced by CoreTech, breaking away from dependence on foreign components and truly achieving full chain independent controllability from core technology to key components, completely breaking the monopoly pattern of foreign enterprises.

As a company born in Wuhan Optics Valley and incubated by a team from Huazhong University of Science and Technology, SMIC has been focusing on the "bottleneck" field of chip equipment since its establishment. Relying on profound technological accumulation, it has deeply cultivated the research and development of chip bonding equipment. Behind this breakthrough is long-term technological accumulation and breakthroughs. During the research and development process, the team has overcome multiple core challenges such as positioning accuracy, multi degree of freedom leveling, and surface quality control. By deeply integrating precision control technology with artificial intelligence algorithms, the equipment can accurately adapt to the bonding requirements of different specifications of chips, balancing accuracy and efficiency. After preliminary testing, the yield of related products has reached the standard for large-scale production, laying a solid foundation for subsequent production verification.

At present, the chip bonding equipment has completed all research and development work and is about to enter the chip production enterprise for verification. Once the verification is passed and large-scale production is achieved, it will significantly reduce the equipment procurement cost of domestic chip enterprises, break the supply monopoly of foreign equipment, and promote the transformation of China's chip packaging industry towards high-end and independent development. At the same time, the successful research and development of equipment has also filled the technological gap in domestic nanoscale chip bonding equipment, improved China's chip equipment industry chain, helped China seize the initiative in global semiconductor equipment competition, and promoted the semiconductor industry to leap from "following" to "running in parallel" and "leading".